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IBM Intel Xeon E5506 Especificaciones Pagina 20

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LGA1366 Socket
20 Thermal/Mechanical Design Guide
2.9 LGA1366 Socket NCTF Solder Joints
Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
for post environmental testing. The processor signals at NCTF locations are typically
redundant ground or non-critical reserved, so the loss of the solder joint continuity at
end of life conditions will not affect the overall product functionality. Figure 2-7
identifies the NCTF solder joints.
.
Note: For platforms supporting the DP processor land C3 is CTF.
§
Figure 2-7. LGA1366 NCTF Solder Joints
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